And TI announces:
http://www.prnewswire.com/cgi-bin/stories.pl?ACCT=104&STORY=/www/story/04-09-2007/0004561608&EDATE=
Texas Instruments DSPs Selected by Raytheon to Provide Processing for Navy's DDG 1000 Zumwalt Class Destroyer Program
High-Performance TMS320C6455 DSPs Process Multiple Channels of Sonar in Next- Generation Multi-Mission Destroyers
HOUSTON, April 9 /PRNewswire/ -- Texas Instruments Incorporated (TI) (NYSE: TXN), the leader in digital signal processing technologies, today announced its high-performance TMS320C6455 digital signal processors (DSPs) have been selected by Raytheon for use in the U.S. Navy's DDG 1000 Zumwalt Class Destroyer program.................
Monday, April 9, 2007
Monday, April 2, 2007
LTE System Test Bed uses RapidIO
From the Ericsson Review No. 1 , 2007
http://www.ericsson.com/ericsson/corpinfo/publications/review/2007_01/files/2_lte_web.pdf
LTE test bed
Bernt Johansson and Tomas Sundin
The Third Generation Partnership Project (3GPP) is specifying the longterm evolution of third-generation cellular systems to meet demands for higher user bit rates. Ericsson has thus developed a test bed to evaluate new access technologies and to investigate the suitability of new implementation technologies for future radio-access products. The authors explain the access concept and anticipated requirements for LTE and describe the test-bed system, architecture, subsystems, and technology...............
....... The LTE test bed
Ericsson designed the LTE test bed around commercially available technology to provide
a flexible, high-performance platform that can serve as the basis for the development
of layer-1, layer-2, and in time, layer-3 (L1, L2, L3) software functionality. The use
of serial RapidIO technology, in particular, helps ensure platform flexibility.
The platform is based on advanced telecom computing architecture (ATCA) and advanced mezzanine card (AMC) processing boards. Together, these form a processor cluster. The test bed connects to an application server and client via TCP/IP over Ethernet................
http://www.ericsson.com/ericsson/corpinfo/publications/review/2007_01/files/2_lte_web.pdf
LTE test bed
Bernt Johansson and Tomas Sundin
The Third Generation Partnership Project (3GPP) is specifying the longterm evolution of third-generation cellular systems to meet demands for higher user bit rates. Ericsson has thus developed a test bed to evaluate new access technologies and to investigate the suitability of new implementation technologies for future radio-access products. The authors explain the access concept and anticipated requirements for LTE and describe the test-bed system, architecture, subsystems, and technology...............
....... The LTE test bed
Ericsson designed the LTE test bed around commercially available technology to provide
a flexible, high-performance platform that can serve as the basis for the development
of layer-1, layer-2, and in time, layer-3 (L1, L2, L3) software functionality. The use
of serial RapidIO technology, in particular, helps ensure platform flexibility.
The platform is based on advanced telecom computing architecture (ATCA) and advanced mezzanine card (AMC) processing boards. Together, these form a processor cluster. The test bed connects to an application server and client via TCP/IP over Ethernet................
Tuesday, March 20, 2007
Monday, February 19, 2007
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